The Huge Challenge of Testing USB 3.2 – #33

USB 3.2 doubles the data rate of previous USB specs, but makes the testing process significantly harder. Find out why in this electrical engineering podcast.
From Keysight Technologies
USB 3.2 doubles the data rate of previous USB specs, but makes the testing process significantly harder. Find out why in this electrical engineering podcast.
USB 3.2 DOUBLES the data transfer capabilities of previous USB specifications, and could mean the end of having USB ports on just one side of your computer. Find out more in today’s electrical engineering podcast with Jit Lim, Daniel Bogdanoff, and Mike Hoffman.
Receiver testing (Rx) was never a concern for DDR design. Until now. The margin for error ran out, and now Rx testing is getting standardized. We sit down with Stephanie Rubalcava to explore the challenges of this new ground.
Keeping specs secret is just part of the job. Getting a usable, working spec is another. Learn why JEDEC guards a spec, the basic DDR architecture, and geek out with us about the challenges of probing DDR.
Hosted by Daniel Bogdanoff and Mike Hoffman, EEs Talk Tech is a twice-monthly engineering podcast discussing tech trends and industry news from an electrical engineer’s perspective.
DDR5 marks a huge shift in thinking for traditional high-tech memory and IO engineering teams. The implications of this are just now being digested by the industry, and opening up doors for new technologies. In today’s electrical engineering podcast, Daniel Bogdanoff and Mike Hoffman sit down with Perry Keller to discuss how engineers should “get their game on” for DDR5.
“It’s a miracle it works at all.” In this electrical engineering podcast, we discuss the state of memory today and it’s inevitable march into the future.
Hosted by Daniel Bogdanoff and Mike Hoffman, EEs Talk Tech is a twice-monthly engineering podcast discussing tech trends and industry news from an electrical engineer’s perspective.
Learn about RF designs, radio frequencies, RADAR, GPS, and RF terms you need to know in today’s electrical engineering podcast!
Wide bandgap semiconductors, like Gallium Nitride (GaN) and Silicon Carbide (SiC) are shaping the future of power electronics by boosting power efficiency and reducing physical footprint. Server farms, alternative energy sources, and electrical grids will all be affected!
Learn how PAM4 is allowing some companies to double their data rate – and the new challenges this brings up for engineers. (electrical engineering podcast)
Learn about parallel computing, the rise of heterogeneous processing (also known as hybrid processing), and quantum engineering in today’s EEs Talk Tech electrical engineering podcast!