Packaging engineers are the unsung heroes of the IC world. Packaging Expert Jesse Rebeck sits down and explores the complexities of IC packaging.
Space requires new technologies. Much like the space race of the 1950s, engineers are feverishly working to gain a competitive advantage. Mark Lombardi sits down to explore rad hardening, thermal vacuum chambers, space mining, CubeSats, and battery technology.
Hosted by Daniel Bogdanoff and Mike Hoffman, EEs Talk Tech is a twice-monthly engineering podcast discussing tech trends and industry news from an electrical engineer’s perspective.
Brig Asay, Melissa, and Daniel Bogdanoff sit down to answer the internet’s questions about the new 110 GHz UXR oscilloscope. How long did it take? What did it cost? Find out!
The USB Type-C brings a lot of protocols into one physical connector, but is there room for one protocol to handle all our IO needs? Mike Hoffman and Daniel Bogdanoff sit down with high speed digital communications expert Jit Lim to find out.
USB 3.2 DOUBLES the data transfer capabilities of previous USB specifications, and could mean the end of having USB ports on just one side of your computer. Find out more in today’s electrical engineering podcast with Jit Lim, Daniel Bogdanoff, and Mike Hoffman.